| 摘要: |
| 摘 要:理论分析了微通道热沉的热阻的组成,采用微机械加工技术和铜直接粘接技术(DBC)制作了
冷却大功率半导体激光器列阵的5层结构的无氧铜微通道热沉;通过测试,用其封装的808 nm线阵二极管
激光器准连续输出功率达38. 5W,无氧铜微通道热沉热阻为0. 645 ℃/W,热沉的表面温度均匀性好,能有
效散热,满足散热要求。 |
| 关键词: 半导体激光器 微通道热沉 热阻 |
| DOI： |
| 分类号:O436 |
| 基金项目:重庆市教委科学技术研究项目? |
|
| Microchannel heatsink for the heat dissipation ofhigh power semiconductor laser diode arrays |
|
TANG Yu - xia
|
| Abstract: |
| Abstract: The thermal resistance ofmicrochannel heatsink is theoretically analyzed. an Oxygen - free coppermicrochannel heat2
sink consisting of five copper sheets is designed and fabricated. By testing, the uniformity of the face temperature of the microchannel
heatsink is good. and the therma resistance l is 0. 645℃/W . the output power of the high power semiconductor diode laser linear arrays
packaged with the microchannel heatsink is 38. 5W. |
| Key words: semiconductor laser diode arrays microchannel heatsink thermal resistance |
